The LG G7 ThinQ Teardown!

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The last LG phone we tore down was the very modular LG G5, which was super easy to take apart and scored an 8 out of 10 on our repairability meter. It’s been a while since we’ve taken apart an LG Phone, so it’s time see what LG has in store for us with the LG G7 ThinQ.

You can use this $20 kit to disassemble most smart phones!

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36 Comments

  1. Contact pins are cool to avoid cables than can break after plugging or unplugging them, but they drive me nuts when they can't make contact anymore (on my ZenFone 2, screws broke so I had to close it with less screws than before, it means I have to press hard on my case while using the volume buttons or they can't make contact without the screws

  2. this pertains to an iPhone 5C <– if I need to switch Logic boards how do I get the original, from the old logic board, IMEI to the new logic board? Do I Bring the NAND Flash chip to the new Logic board? Bring the CPU's to the new logic board? or Both? Or do I need to reprogram the new NAND Flash chip with the information from the old NAND Flash chip???

  3. I feel like ifixit repairability scores have gotten less kind over time, this is pretty standard for phones since 2017 and with how modular the G7 is I'd give it at least a 6/10….

  4. Specs on this phone are pretty good, and i feel heat problems won't be as common in this phone as with the G5, however I'm on the fence about whether or not I should consider this phone. I don't like the notch or the low/difficult repairability, but the specs, water resistance, and headphone jack are a big plus.

    internal screaming

  5. Damn, the Snapdragon 845 needs that much heat dissipation, the A11 processor is in a PCB sandwich and performs better. Qualcomm are definitely second best.